Method for measuring a characteristic of a semiconductor wafer using cylindrical control
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United States of America Patent
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Nov 9, 1999
Grant Date -
N/A
app pub date -
Jan 27, 1997
filing date -
Jan 27, 1997
priority date (Note) -
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Abstract
The time required to make test measurements across a large diameter wafer, such as a 300 mm wafer, is reduced by using a wafer measuring system that employs theta (.theta.) and radial (r) control instead of X-Y control. In one embodiment, a measurement arm (14) having a measurement head (16) is positioned over a wafer chuck (18) and a wafer (12) is placed onto the wafer chuck (18). The wafer (12) is then moved to one or more measuring points below the measurement head (16) via theta rotation (.theta.) and radial positioning. A measurement is then taken at the selected location.
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