Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover
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United States of America Patent
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Nov 16, 1999
Issued Date -
N/A
app pub date -
Sep 30, 1997
filing date -
Jul 15, 1996
priority date (Note) -
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Abstract
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.
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