Method of making polymeric semiconductor body
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United States of America Patent
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Nov 16, 1999
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app pub date -
May 22, 1998
filing date -
Jun 29, 1993
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Abstract
The method of making a semiconductor body from a semiconductor polymeric compound containing about 20% by weight lampblack having a porous structure, about 60% by weight of low density polyethylene, about 8.5% by weight ethylene vinyl acetate copolymer, about 4.0% by weight calcium stearate, about 3.0% by weight antioxidant and about 0.5% by weight calcium titanate includes the steps of extruding the semiconductor polymeric compound to form an extruded product and subsequently calendering the extruded product to produce a semiconductor body having an electrical conductivity which is as uniform as possible throughout the entire bulk of the semiconductor body.
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