Method of customizing integrated circuits using standard masks and targeting energy beams
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United States of America Patent
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Nov 16, 1999
Grant Date -
N/A
app pub date -
Mar 24, 1997
filing date -
Mar 24, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for fabricating custom integrated circuits includes the steps of 1) patterning the layer to be customized with standard precision masking techniques to define all possible connections, vias or cut-points, and 2) using a non-precision targeting energy beam to select the desired connections, vias or cut-points for customization. Consequently, the present invention requires no custom mask so that application specific integrated circuits (ASICs) can be produced with lower lead-time and costs when compared to prior methods. In other embodiments, a non-precision configuration mask may replace the targeting energy beam, where the configuration mask can be made by conventional mask-making techniques or by applying an opaque layer to a mask blank and using a targeting energy beam to selectively remove the desired portions of the opaque areas.
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