Semiconductor apparatus and method for fabricating the same
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United States of America Patent
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Nov 16, 1999
Grant Date -
N/A
app pub date -
Aug 22, 1997
filing date -
Feb 27, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor apparatus includes a semiconductor chip and a die pad on which the semiconductor chip is mounted. The die pad is provided thereon with an opening. The semiconductor chip and the die pad may be shaped to be similar figures of rectangle, and the opening may include a plurality of first slits which are arranged around the corners of the die pad, respectively.
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