Importance

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Abstract

In a semiconductor processing apparatus, an external transfer mechanism transfers substrates between a cassette for storing a plurality of target substrates by vertically arranging the substrates at first intervals, and a processing section for performing semiconductor processing for the substrates. The external transfer mechanism has first and second arms defining first and second support surfaces each of which can support one of the substrates and capable of vertically moving relative to each other. An interval adjuster is disposed to adjust an interval in a vertical direction between the first and second support surfaces by moving the first and second arms relative to each other. An arm driving base is disposed to move the first and second arms between a position at which the first and second arms oppose the cassette and a position at which the first and second arms oppose the processing section. The thickness of each of the first and second arms in the vertical direction is smaller than the first interval. The first and second arms can be set in an overlapping state, in which the first and second arms overlap each other in a horizontal direction, by the interval adjuster. By simultaneously operating the first and second arms, processed and unprocessed substrates can be exchanged at once in the cassette.

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First Claim