Multi-layer ceramic electronic part
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United States of America Patent
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Nov 23, 1999
Grant Date -
N/A
app pub date -
Jul 2, 1997
filing date -
Jul 4, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A highly reliable multi-layer ceramic electronic part in which is compact, in which cracks tend not to occur in the ceramic element even in cases where it is handled in bulk by a chip mounting device. A plurality of electrodes (internal electrodes) are disposed within a ceramic element whose length L.ltoreq.1.0 mm, height H.ltoreq.0.5 mm and width W.ltoreq.0.5 mm. The thickness t.sub.1 of a ceramic outer layer portion of the multi-layer ceramic electronic part, is 0.15 mm or less. The thickness of the ceramic outer layer portion t.sub.1 and the thickness t.sub.2 of the portion where the internal electrodes are disposed have the relationship 1/4 t.sub.2 .ltoreq.t.sub.1.ltoreq.1/3 t.sub.2.
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