Semiconductor package having a connection member
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United States of America Patent
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Nov 23, 1999
Grant Date -
N/A
app pub date -
Nov 8, 1996
filing date -
Dec 29, 1995
priority date (Note) -
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Importance
Abstract
A ball grid array (BGA) semiconductor package includes a package case having a recess in an upper surface thereof, a semiconductor chip received in the recess, and a connection means provided on an active region of the chip. A molding compound molds the chip and fills a gap between the package case and the connection member. The package enables a thinner package fabrication and reduces an access time of a package device, thereby realizing a high speed device.
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