Three-dimensional molded sockets for mechanical and electrical component attachment
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United States of America Patent
Stats
-
Nov 30, 1999
Grant Date -
N/A
app pub date -
Mar 27, 1997
filing date -
Mar 27, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.
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