Ball grid array semiconductor package
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United States of America Patent
Stats
-
Nov 30, 1999
Grant Date -
N/A
app pub date -
Mar 6, 1997
filing date -
Mar 6, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A ball grid array semiconductor package includes an insulative base material; circuitry metallizations formed on a first surface of the material, each metallization having a grid pad electrode; and a semiconductor chip mounted on the first surface and electrically connected to the circuitry metallizations. The base material is opened from a second surface of the base material at a location under each grid pad electrode; and each opening confines a portion of a solder ball which is in melt-fixed connection to a back side of each grid electrode.
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