Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
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United States of America Patent
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Nov 30, 1999
Grant Date -
N/A
app pub date -
Dec 23, 1997
filing date -
Jun 27, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microwave circuit having a two-sided substrate on which a microwave lead-through is arranged in the form of a symmetrical lead-through structure, being provided by opposite metallizationless areas on the upperside and the underside of the substrate and comprising a lead-through conductor, coplanar width adaption segments and first and second line segments connected thereto, the ground of said segments comprising opposite metallization parts being inter-connected through via holes. In a sealed microwave circuit a seal lead-through comprises said lead-through structure and a microstrip line segment.
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