Heat-sinking arrangement for circuit elements
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United States of America Patent
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Nov 30, 1999
Grant Date -
N/A
app pub date -
Aug 6, 1998
filing date -
Sep 1, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity formed in its insulating layer extending to an earthing layer and filled with a silver paste to form a seat for mounting a CPU that can thus thermally contact with the earthing layer, and a second substrate has a cavity formed in an insulating layer in which cavity a heat-conducting cushion bonded to the top of the CPU is fitted for creating the heat-conductive route between the CPU and the earthing layer of the second substrate.
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