Radiation enhanced chip encapsulant
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United States of America Patent
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Dec 7, 1999
Grant Date -
N/A
app pub date -
Feb 23, 1996
filing date -
Feb 23, 1996
priority date (Note) -
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Abstract
A shielding apparatus for an electronic component includes a first insulative encapsulant surrounding at least a portion of the component and a second encapsulant surrounding said first encapsulant and having conductive particles dispersed therein for absorbing ionizing radiation.
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