Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
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United States of America Patent
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Dec 7, 1999
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N/A
app pub date -
Dec 12, 1997
filing date -
Dec 12, 1997
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Abstract
A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into 'bins' according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.
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