Resin sealing type semiconductor device
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United States of America Patent
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-
Dec 7, 1999
Grant Date -
N/A
app pub date -
Dec 15, 1997
filing date -
Jan 20, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resin sealing type semiconductor device capable of making a resin burr hard to occur when formed by molds and of restraining cracks in solder, is actualized by providing a stepped portion on a resin sealing body for covering a circuit forming surface of a semiconductor chip, making leads exposed from this exposed surface and joining solder bumps to the leads.
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