US Patent No: 6,000,124

Number of patents in Portfolio can not be more than 2000

Method and apparatus for manufacturing multilayer printed circuit board

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A method and apparatus for manufacturing a multilayer printed circuit board wherein printed circuit boards are laminated by accurate in positional alignment. A first supporting means for supporting a first printed circuit board is provided on a lower table 11 and second supporting means for supporting a second printed circuit board P2 is provided thereover. One end of the lower table is supported by a first movement means equipped with an XY table mechanism and another end thereof is supported by a Y table mechanism and second movement means for enabling an X-directional free sliding movement. The positions of respective marks m and n on the printed circuit boards are imaged by imaging means. The printed circuit boards are relatively moved by the movement means and the positional error thereof is corrected based on image processing. The first and second printed circuit boards are then secured together.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SEIKO PRECISION INC.TOKYO418

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Araki, Masatoshi Tokyo, JP 16 61
Saito, Tsutomu Shizuoka-ken, JP 123 786
Sunamoto, Shigemi Tokyo, JP 1 26

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,048,178 Alignment--registration tool for fabricating multi-layer electronic packages 32 1990
 
LENKEIT INDUSTRIES, INC. (1)
4,506,442 Method and apparatus for stacking a plurality of laminate layers to form a composite board 23 1982
 
WORLD PROPERTIES, INC. (1)
5,046,238 Method of manufacturing a multilayer circuit board 104 1990

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICROSOFT CORPORATION (11)
7,392,472 Layout analysis 7 2002
7,263,227 Activity detector 5 2002
7,164,797 Clustering 1 2002
7,120,297 Segmented layered image system 23 2002
7,110,596 System and method facilitating document image compression utilizing a mask 4 2002
7,376,275 Clustering 5 2005
7,397,952 "Don't care" pixel interpolation 3 2005
7,512,274 Block retouching 1 2006
7,764,834 System and method facilitating document image compression utilizing a mask 1 2006
7,376,266 Segmented layered image system 9 2006
7,386,171 Activity detector 0 2007
 
IBIDEN CO., LTD. (4)
6,609,297 Method of manufacturing multilayer printed wiring board 18 2000
7,127,812 Process for producing a multi-layer printed wiring board 5 2003
7,375,289 Multi-layer printed wiring board including an alignment mark as an index for a position of via holes 0 2006
7,761,984 Process for producing multi-layer printed wiring board 0 2008
 
AMKOR TECHNOLOGY, INC. (2)
6,479,887 Circuit pattern tape for wafer-scale production of chip size semiconductor packages 19 1999
6,428,641 Method for laminating circuit pattern tape on semiconductor wafer 10 1999
 
CAMTEK LTD. (1)
6,754,551 Jet print apparatus and method for printed circuit board manufacturing 23 2000
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,338,194 Method of making a circuitized substrate assembly with carrier having substrates therein 1 2000
 
ISOLA USA CORP. (1)
6,658,375 Compensation model and registration simulation apparatus and method for manufacturing of printed circuit boards 10 1999
 
MANIABARCO, INC. (1)
6,804,388 Method and apparatus of registering a printed circuit board 2 2001
 
OAK-MITSUI, INC. (1)
6,606,792 Process to manufacturing tight tolerance embedded elements for printed circuit boards 5 2000
 
PANASONIC CORPORATION (1)
7,809,461 Working apparatus and working method for circuit board 0 2006
 
SONY CORPORATION (1)
6,780,262 Multilayer disc manufacturing apparatus, and disc bonding method 0 2002
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
8,289,727 Package substrate 0 2010
 
ZHEN DING TECHNOLOGY CO., LTD. (1)
8,302,300 Method for manufacturing multilayer printed circuit board with plated through holes 0 2011