Method and apparatus for manufacturing multilayer printed circuit board
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United States of America Patent
Stats
-
Dec 14, 1999
Grant Date -
N/A
app pub date -
Apr 25, 1997
filing date -
Nov 7, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for manufacturing a multilayer printed circuit board wherein printed circuit boards are laminated by accurate in positional alignment. A first supporting means for supporting a first printed circuit board is provided on a lower table 11 and second supporting means for supporting a second printed circuit board P2 is provided thereover. One end of the lower table is supported by a first movement means equipped with an XY table mechanism and another end thereof is supported by a Y table mechanism and second movement means for enabling an X-directional free sliding movement. The positions of respective marks m and n on the printed circuit boards are imaged by imaging means. The printed circuit boards are relatively moved by the movement means and the positional error thereof is corrected based on image processing. The first and second printed circuit boards are then secured together.
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Cited Art Landscape
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