Electronic component cooling system
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United States of America Patent
Stats
-
Dec 14, 1999
Grant Date -
N/A
app pub date -
May 7, 1997
filing date -
Mar 12, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component cooling system for printed circuit board enclosures includes a plurality of fans, each coupled to an air deflection unit which selectively forces air from the fans through the printed circuit boards. The system includes at least one thermal diffuser and at least one air concentrator. The thermal diffuser is placed between a stack of two or more shelving units to avoid the development of hot spots or dead zones. The air concentrator provides the ability for certain components which have a high heat output to receive a greater amount of air flow than other components which have lower heat outputs.
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