Baking apparatus and baking method
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United States of America Patent
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Dec 14, 1999
Grant Date -
N/A
app pub date -
Jan 9, 1998
filing date -
Jan 16, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
The baking apparatus of the present invention comprises a casing surrounding a substrate W having a pattern-exposed resist film, a hot plate for heating the substrate in the casing, gas supply mechanisms for supplying a H.sub.2 O component containing humidity gas into the casing. The H.sub.2 O component included in the humidity gas is allowed to react with the resist film by introducing the humidity gas into the casing while the substrate is being heated by the hot plate, thereby rendering either an irradiate portion or a non-irradiate portion of the resist film, soluble in alkali.
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