Microelectronic component with rigid interposer
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United States of America Patent
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-
Dec 14, 1999
Grant Date -
N/A
app pub date -
Nov 25, 1997
filing date -
Nov 25, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.
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