Laser alignment target
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United States of America Patent
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Dec 14, 1999
Issued Date -
N/A
app pub date -
Mar 13, 1998
filing date -
Apr 10, 1996
priority date (Note) -
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Abstract
A technique to form a structure with a rough topography (415) in a planarized semiconductor process. The rough topography (415) is formed by creating cored contacts (433). Subsequent process layers may be further stacked on top of the cored contacts in order to augment the nonplanar characteristics of the cored contacts. This rough topography structure may be used to align integrated circuits and wafers. An integrated circuit may be laser aligned using this alignment structure.
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