Integrated circuit package for coupling to a printed circuit board
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United States of America Patent
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-
Dec 14, 1999
Grant Date -
N/A
app pub date -
Jul 21, 1997
filing date -
Jul 21, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.
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