Microcutting device and incising method
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United States of America Patent
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-
Dec 21, 1999
Grant Date -
N/A
app pub date -
Feb 27, 1998
filing date -
Feb 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microcutting device incises minute samples of organisms, such as egg cells and protozoa, and the like. This device is made of a thin film plate which is formed by use of a semiconductor manufacturing technique, and has a heater in the vicinity of its cutting edge. The microcutting device is sharper than a metal-blade incision device and is suitable of mass production.
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