Method of and apparatus for processing photoresist, method of evaluating photoresist film, and processing apparatus using the evaluation method
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United States of America Patent
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Dec 21, 1999
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N/A
app pub date -
Mar 4, 1998
filing date -
Mar 5, 1997
priority date (Note) -
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Abstract
A resist processing method includes setting a substrate at a specific temperature, forming a resist film on the substrate by applying a resist solution onto the substrate while turning the substrate set at the specific temperature, heating the substrate on which the resist film has been formed, cooling the substrate a specific temperature after the heating process, wherein the thickness of the resist film on the substrate is measured between the heating process and the cooling process.
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