Carbon dioxide cleaning process
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United States of America Patent
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-
Dec 21, 1999
Grant Date -
N/A
app pub date -
Jul 9, 1997
filing date -
Jul 9, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for cleaning parts employed during the processing of semiconductor wafers includes a first cleaning step for removing super-micron particles and a second cleaning step for removing sub-micron particles. The second step utilizes frozen carbon dioxide pellets and removes contaminant particles have a size of less than one micron. The cleaning method consistently removes substantially all sub-micron particles from a work surface.
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