Increasing the gap between a lead frame and a semiconductor die
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United States of America Patent
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Dec 21, 1999
Grant Date -
N/A
app pub date -
Oct 6, 1997
filing date -
Oct 6, 1997
priority date (Note) -
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Abstract
Apparatus and method of increasing the distance of the gap between a lead frame and a semiconductor die surface in a package assembly. An adhesive layer and a gap increasing layer are disposed between the lead frame and the semiconductor die surface. The gap increasing layer has a thickness selected to reduce likelihood of package particles from being trapped between the lead frame and the die surface. The gap increasing layer includes silver plating, and has a thickness of at least about 300 to 500 microinches.
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