Ball grid array capacitor
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United States of America Patent
Stats
-
Dec 21, 1999
Grant Date -
N/A
app pub date -
Nov 10, 1998
filing date -
Nov 10, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.
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Cited Art Landscape
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