US Patent No: 6,005,777
Number of patents in Portfolio can not be more than 2000
Ball grid array capacitor
Stats
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Dec 21, 1999
Issued date -
Nov 10, 1998
filing date -
09/189,592
serial no -
In Force
status
Importance
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Abstract
A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.
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First Claim
Related Publications
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International Classification(s)
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- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,945,399 Electronic package with integrated distributed decoupling capacitors | 43 | 1989 | |
| 5,539,186 Temperature controlled multi-layer module | 41 | 1992 | |
| 5,745,334 Capacitor formed within printed circuit board | 65 | 1996 | |
| 5,796,587 Printed circut board with embedded decoupling capacitance and method for producing same | 50 | 1996 | |
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| 4,658,234 Resistor network | 14 | 1985 | |
| 4,654,628 Network resistor unit | 10 | 1986 | |
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| 5,216,404 SiC thin-film thermistor | 26 | 1991 | |
| 5,636,099 Variable capacitor formed by multilayer circuit board | 30 | 1995 | |
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| 4,332,341 Fabrication of circuit packages using solid phase solder bonding | 71 | 1979 | |
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| 5,621,619 All ceramic surface mount sip and dip networks having spacers and solder barriers | 19 | 1995 | |
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| 5,635,767 Semiconductor device having built-in high frequency bypass capacitor | 145 | 1995 | |
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| 5,557,502 Structure of a thermally and electrically enhanced plastic ball grid array package | 81 | 1995 | |
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| 5,903,050 Semiconductor package having capacitive extension spokes and method for making the same | 122 | 1998 | |
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| 5,726,485 Capacitor for a semiconductor device | 14 | 1996 | |
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| 5,379,190 Chip-type composite electronic part and manufacturing method therefor | 20 | 1993 | |
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| 5,661,450 Low inductance termination resistor arrays | 23 | 1995 | |
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| 4,300,115 Multilayer via resistors | 30 | 1980 | |
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| 5,870,274 Capacitive PCB with internal capacitive laminate | 67 | 1997 | |