Ball grid array capacitor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6005777
SERIAL NO

09189592

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CTS CorporationELKHART, IN200
CTC CorporationHOUSTON, TX2

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bloom, Terry R Middlebury, IN 25 241
Cooper, Richard O Bluffton, IN 6 101
Reinhard, Robert L Berne, IN 3 56

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
* 4945399 Electronic package with integrated distributed decoupling capacitors 51 1989
* 5539186 Temperature controlled multi-layer module 44 1992
* 5745334 Capacitor formed within printed circuit board 74 1996
 
HADCO SANTA CLARA, INC. (1)
* 5870274 Capacitive PCB with internal capacitive laminate 77 1997
 
CTS Corporation (1)
* 5621619 All ceramic surface mount sip and dip networks having spacers and solder barriers 22 1995
 
ALPS ELECTRIC CO., LTD. (2)
* 4658234 Resistor network 14 1985
* 4654628 Network resistor unit 10 1986
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5635767 Semiconductor device having built-in high frequency bypass capacitor 164 1995
 
MICRON TECHNOLOGY, INC. (1)
* 5726485 Capacitor for a semiconductor device 16 1996
 
GLOBALFOUNDRIES INC. (1)
* 5796587 Printed circut board with embedded decoupling capacitance and method for producing same 58 1996
 
SUN MICROSYSTEMS, INC. (1)
* 5661450 Low inductance termination resistor arrays 27 1995
 
INTEL CORPORATION (1)
* 5557502 Structure of a thermally and electrically enhanced plastic ball grid array package 83 1995
 
ROHM CO., LTD. (1)
* 5379190 Chip-type composite electronic part and manufacturing method therefor 20 1993
 
The United States of America as represented by the Secretary of the Army (1)
* 4300115 Multilayer via resistors 30 1980
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 5903050 Semiconductor package having capacitive extension spokes and method for making the same 150 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 5216404 SiC thin-film thermistor 29 1991
* 5636099 Variable capacitor formed by multilayer circuit board 31 1995
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
* 2006/0281,342 Methods Of Making A Interconnect 1 2006
* 2007/0164,433 Ball grid array package 1 2007
 
NITTO DENKO CORPORATION (1)
* 6198052 Circuit board with terminal accommodating level differences 10 1999
 
CTS Corporation (19)
6326677 Ball grid array resistor network 17 1998
* 6194979 Ball grid array R-C network with high density 17 1999
6856516 Ball grid array resistor capacitor network 5 2002
* 2004/0037,058 Ball grid array resistor capacitor network 0 2002
6897761 Ball grid array resistor network 8 2002
* 2004/0108,937 Ball grid array resistor network 3 2002
6882266 Ball grid array resistor network having a ground plane 6 2003
7180186 Ball grid array package 0 2003
* 2005/0024,839 Ball grid array package 0 2003
6946733 Ball grid array package having testing capability after mounting 4 2003
* 2005/0035,450 Ball grid array package having testing capability after mounting 0 2003
7342804 Ball grid array resistor capacitor network 3 2004
* 6963265 Ball grid array resistor network having a ground plane 4 2004
7724109 Ball grid array filter 2 2006
7940148 Ball grid array resonator 2 2007
* 2008/0106,356 Ball grid array resonator 1 2007
7646255 Voltage controlled oscillator module with ball grid array resonator 0 2007
* 2008/0116,981 Voltage controlled oscillator module with ball grid array resonator 1 2007
* 2009/0236,134 Low frequency ball grid array resonator 1 2009
 
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (2)
* 7548432 Embedded capacitor structure 2 2005
* 2006/0215,380 Embedded capacitor structure 23 2005
 
STMICROELECTRONICS S.R.L. (2)
9001521 Substrate assembly provided with capacitive interconnections, and manufacturing method thereof 0 2011
8982574 Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing 0 2012
 
APPLIED MATERIALS, INC. (1)
* 2003/0166,342 Integrated method for release and passivation of MEMS structures 0 2002
 
GLOBALFOUNDRIES INC. (3)
* 6609296 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 1 2000
8044512 Electrical property altering, planar member with solder element in IC chip package 1 2009
* 2010/0327,405 ELECTRICAL PROPERTY ALTERING, PLANAR MEMBER WITH SOLDER ELEMENT IN IC CHIP PACKAGE 1 2009
 
RENESAS ELECTRONICS CORPORATION (1)
* 8575721 Semiconductor device 0 2012
 
MOLEX INCORPORATED (2)
6612852 Contactless interconnection system 10 2000
6362972 Contactless interconnection system 4 2000
 
AGILENT TECHNOLOGIES, INC. (2)
* 2004/0043,640 High density interconnect 0 2002
7094063 High density interconnect 0 2004
 
MOTOROLA SOLUTIONS, INC. (4)
7056800 Printed circuit embedded capacitors 6 2003
* 2005/0128,720 Printed circuit embedded capacitors 5 2003
* 7138068 Printed circuit patterned embedded capacitance layer 3 2005
* 2006/0207,970 Printed circuit patterned embedded capacitance layer 4 2005
* Cited By Examiner