US Patent No: 6,005,777

Number of patents in Portfolio can not be more than 2000

Ball grid array capacitor

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Importance

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Abstract

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A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CTS CORPORATIONELKHART, IN633
CTC CORPORATIONHOUSTON, TX5

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bloom, Terry R Middlebury, IN 31 222
Cooper, Richard O Bluffton, IN 6 95
Reinhard, Robert L Berne, IN 3 53

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
4,945,399 Electronic package with integrated distributed decoupling capacitors 46 1989
5,539,186 Temperature controlled multi-layer module 41 1992
5,745,334 Capacitor formed within printed circuit board 69 1996
5,796,587 Printed circut board with embedded decoupling capacitance and method for producing same 54 1996
 
ALPS ELECTRIC CO., LTD. (2)
4,658,234 Resistor network 14 1985
4,654,628 Network resistor unit 10 1986
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
5,216,404 SiC thin-film thermistor 27 1991
5,636,099 Variable capacitor formed by multilayer circuit board 31 1995
 
Bell Telephone Laboratories, Incorporated (1)
4,332,341 Fabrication of circuit packages using solid phase solder bonding 72 1979
 
CTS CORPORATION (1)
5,621,619 All ceramic surface mount sip and dip networks having spacers and solder barriers 22 1995
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,635,767 Semiconductor device having built-in high frequency bypass capacitor 158 1995
 
HADCO SANTA CLARA, INC. (1)
5,870,274 Capacitive PCB with internal capacitive laminate 73 1997
 
INTEL CORPORATION (1)
5,557,502 Structure of a thermally and electrically enhanced plastic ball grid array package 81 1995
 
LSI LOGIC CORPORATION (1)
5,903,050 Semiconductor package having capacitive extension spokes and method for making the same 133 1998
 
MICRON TECHNOLOGY, INC. (1)
5,726,485 Capacitor for a semiconductor device 14 1996
 
ROHM CO., LTD. (1)
5,379,190 Chip-type composite electronic part and manufacturing method therefor 20 1993
 
SUN MICROSYSTEMS, INC. (1)
5,661,450 Low inductance termination resistor arrays 25 1995
 
The United States of America as represented by the Secretary of the Army (1)
4,300,115 Multilayer via resistors 30 1980

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
CTS CORPORATION (12)
6,326,677 Ball grid array resistor network 17 1998
6,194,979 Ball grid array R-C network with high density 16 1999
6,856,516 Ball grid array resistor capacitor network 5 2002
6,897,761 Ball grid array resistor network 8 2002
6,882,266 Ball grid array resistor network having a ground plane 5 2003
7,180,186 Ball grid array package 0 2003
6,946,733 Ball grid array package having testing capability after mounting 4 2003
7,342,804 Ball grid array resistor capacitor network 3 2004
6,963,265 Ball grid array resistor network having a ground plane 4 2004
7,724,109 Ball grid array filter 1 2006
7,940,148 Ball grid array resonator 0 2007
7,646,255 Voltage controlled oscillator module with ball grid array resonator 0 2007
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,609,296 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 1 2000
8,044,512 Electrical property altering, planar member with solder element in IC chip package 1 2009
 
MOLEX INCORPORATED (2)
6,612,852 Contactless interconnection system 6 2000
6,362,972 Contactless interconnection system 4 2000
 
MOTOROLA SOLUTIONS, INC. (2)
7,056,800 Printed circuit embedded capacitors 4 2003
7,138,068 Printed circuit patterned embedded capacitance layer 3 2005
 
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (1)
7,548,432 Embedded capacitor structure 1 2005
 
AGILENT TECHNOLOGIES, INC. (1)
7,094,063 High density interconnect 0 2004
 
NITTO DENKO CORPORATION (1)
6,198,052 Circuit board with terminal accommodating level differences 10 1999
 
RENESAS ELECTRONICS CORPORATION (1)
8,575,721 Semiconductor device 0 2012