US Patent No: 6,005,777

Number of patents in Portfolio can not be more than 2000

Ball grid array capacitor

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CTS CORPORATIONELKHART, IN196
CTC CORPORATIONHOUSTON, TX2

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bloom, Terry R Middlebury, IN 31 223
Cooper, Richard O Bluffton, IN 6 95
Reinhard, Robert L Berne, IN 3 53

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
* 4,945,399 Electronic package with integrated distributed decoupling capacitors 46 1989
* 5,539,186 Temperature controlled multi-layer module 41 1992
* 5,745,334 Capacitor formed within printed circuit board 69 1996
* 5,796,587 Printed circut board with embedded decoupling capacitance and method for producing same 56 1996
 
ALPS ELECTRIC CO., LTD. (2)
* 4,658,234 Resistor network 14 1985
* 4,654,628 Network resistor unit 10 1986
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 5,216,404 SiC thin-film thermistor 27 1991
* 5,636,099 Variable capacitor formed by multilayer circuit board 31 1995
 
CTS CORPORATION (1)
* 5,621,619 All ceramic surface mount sip and dip networks having spacers and solder barriers 22 1995
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5,635,767 Semiconductor device having built-in high frequency bypass capacitor 158 1995
 
HADCO SANTA CLARA, INC. (1)
* 5,870,274 Capacitive PCB with internal capacitive laminate 75 1997
 
INTEL CORPORATION (1)
* 5,557,502 Structure of a thermally and electrically enhanced plastic ball grid array package 81 1995
 
LSI LOGIC CORPORATION (1)
* 5,903,050 Semiconductor package having capacitive extension spokes and method for making the same 135 1998
 
MICRON TECHNOLOGY, INC. (1)
* 5,726,485 Capacitor for a semiconductor device 14 1996
 
ROHM CO., LTD. (1)
* 5,379,190 Chip-type composite electronic part and manufacturing method therefor 20 1993
 
SUN MICROSYSTEMS, INC. (1)
* 5,661,450 Low inductance termination resistor arrays 25 1995
 
The United States of America as represented by the Secretary of the Army (1)
* 4,300,115 Multilayer via resistors 30 1980
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
CTS CORPORATION (12)
6,326,677 Ball grid array resistor network 17 1998
* 6,194,979 Ball grid array R-C network with high density 16 1999
6,856,516 Ball grid array resistor capacitor network 5 2002
6,897,761 Ball grid array resistor network 8 2002
6,882,266 Ball grid array resistor network having a ground plane 5 2003
7,180,186 Ball grid array package 0 2003
6,946,733 Ball grid array package having testing capability after mounting 4 2003
7,342,804 Ball grid array resistor capacitor network 3 2004
* 6,963,265 Ball grid array resistor network having a ground plane 4 2004
7,724,109 Ball grid array filter 1 2006
7,940,148 Ball grid array resonator 0 2007
7,646,255 Voltage controlled oscillator module with ball grid array resonator 0 2007
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 6,609,296 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 1 2000
8,044,512 Electrical property altering, planar member with solder element in IC chip package 1 2009
 
MOLEX INCORPORATED (2)
6,612,852 Contactless interconnection system 6 2000
6,362,972 Contactless interconnection system 4 2000
 
MOTOROLA SOLUTIONS, INC. (2)
7,056,800 Printed circuit embedded capacitors 4 2003
* 7,138,068 Printed circuit patterned embedded capacitance layer 3 2005
 
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (1)
* 7,548,432 Embedded capacitor structure 1 2005
 
AGILENT TECHNOLOGIES, INC. (1)
7,094,063 High density interconnect 0 2004
 
NITTO DENKO CORPORATION (1)
* 6,198,052 Circuit board with terminal accommodating level differences 10 1999
 
RENESAS ELECTRONICS CORPORATION (1)
* 8,575,721 Semiconductor device 0 2012
* Cited By Examiner