Chip stacking and capacitor mounting arrangement including spacers
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United States of America Patent
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Dec 21, 1999
Issued Date -
N/A
app pub date -
Jul 29, 1996
filing date -
Jun 15, 1995
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Abstract
Chip stacking and capacitor mounting arrangement including a planar spacer separating a first die and a second die. A conductive spacer provides for backside chip grounding in one application and provides for capacitor mounting in another application.
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