Abrasive construction for semiconductor wafer modification
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United States of America Patent
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Dec 28, 1999
Issued Date -
N/A
app pub date -
Aug 20, 1997
filing date -
Aug 8, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
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