Diode device
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United States of America Patent
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Dec 28, 1999
Grant Date -
N/A
app pub date -
Mar 13, 1998
filing date -
Mar 14, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A diode device for face down bonding use comprising: a semiconductor main body; a first region for forming an electrode, the region being exposed at a first surface of the semiconductor main body; a first electrode provided in the first region; a second region for forming another electrode, the second region being provided within the semiconductor main body; a third region conducting the second region to the first surface through the semiconductor main body; and a second electrode provided in the third region on the first surface.
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