Method of making a printed circuit board having filled holes
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United States of America Patent
Stats
-
Jan 4, 2000
Grant Date -
N/A
app pub date -
Jul 15, 1998
filing date -
Jul 15, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
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Cited Art Landscape
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