Reflow soldering method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 4, 2000
Issued Date -
N/A
app pub date -
Mar 27, 1998
filing date -
Mar 27, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit card) that includes solder. The soldering surface and solder are heated in an oven to melt the solder. While the solder is liquids, the nonvertically approaching lead is mated with the soldering surface as it is inserted into the solder. The soldering surface, solder, and nonvertically approaching lead are then cooled, and the solder solidifies to conductively mount the nonvertically approaching lead to the soldering surface.
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