Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
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United States of America Patent
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Jan 4, 2000
Grant Date -
N/A
app pub date -
Aug 12, 1997
filing date -
Aug 12, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
Conductive interconnections are formed by depositing an adhesive material, made up of ferromagnetic particles dispersed within a matrix material, on a semiconductor substrate, such as an electronic component, and applying a magnetic field between an exposed surface of the adhesive material and an attached surface of the adhesive material (abutting the semiconductor substrate), such that a plurality of the ferromagnetic particles move and align within the matrix material under the influence of the magnetic field. One method of the present invention comprises depositing the adhesive material on a contact site of a first electronic component. A second electronic component having a contact site is aligned over the adhesive material and a magnetic field is applied between the first electronic component and the second electronic component. The first electronic component and the second electronic component are then pressed together such that a portion of the plurality of the ferromagnetic particles makes electrical contact with both the first electronic component bond pad and its corresponding second electronic component bond pad.
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