Ball grid array semiconductor package with solder ball openings in an insulative base
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 4, 2000
Issued Date -
N/A
app pub date -
Aug 1, 1997
filing date -
Aug 1, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An area grid array package such as a ball grid array enables high pin count and high density with no problems of routing, and at low cost. Independent and non-connected circuits are formed on a first surface and a second surface of an insulative base material, each circuit on each surface having first chip connection pads formed on one end to connect to a semiconductor chip, the other end having second solder ball pads to mount solder balls. The chip is connected to the first connection pads by either bonding wires or connection bumps extending through holes in the base material and are molded by a resin. Each solder ball pad on each surface has a solder ball attached with the solder balls extending through openings in the base material. The insulative base material and the semiconductor chip may be attached to a heat slug.
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