High sensitivity micro-machined pressure sensors and acoustic transducers

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United States of America Patent

PATENT NO 6012335
SERIAL NO

08932410

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Abstract

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A method of making a pressure sensor or acoustic transducer having high sensitivity and reduced size. A thin sensing diaphragm is produced by growing a single crystal, highly doped silicon layer on a substrate using a chemical vapor deposition process. The diaphragm is incorporated into a pressure sensor or acoustic transducer which detects pressure variations by a change in the capacitance of a capacitor which includes the diaphragm as a movable member. The thin diaphragm produces a highly sensitive device which can be fabricated in a smaller size than sensors or transducers having thicker diaphragms.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL SEMICONDUCTOR CORPORATIONSANTA CLARA CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bashir, Rashid Santa Clara, CA 79 2503
Kabir, Abul Sunnyvale, CA 2 120

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