Apparatus for attaching adhesive tape to lead-on-chip leadframes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2000
Issued Date -
N/A
app pub date -
Jul 24, 1997
filing date -
Jul 31, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for attaching adhesive tape to a leadframe. The apparatus includes: a support frame; an adhesive tape on a reel mounted to the frame; a stationary cutter base mounted to the frame with an opening therethrough having a peripheral outline where the opening receives a leading terminal end of the tape and a portion of the tape following the leading terminal end, a channel in the base to guide the tape into the opening, and a block to hold the tape in the channel and in the opening; and a cutter which moves through the opening to cut a decal from the tape within the opening and to apply the decal to a leadframe. The cutter and the decal having an outline substantially matching the peripheral outline of the opening such that wasted tape is eliminated.
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