Apparatus and method for forming liquid film

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United States of America Patent

PATENT NO 6012858
SERIAL NO

09124893

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A liquid film formation apparatus comprises a substrate holding portion for holding a substrate substantially horizontally so as to allow a pattern-to-be-formed surface to face upward, a liquid-receiving base surrounding the substrate held by the substrate holding portion and having a liquid-receiving face which is placed at substantially the same level as that of an upper surface of the substrate, a supply nozzle having a process-liquid spray section whose length is equal to or longer than the width of an effective region of the substrate, and a moving mechanism for moving the supply nozzle in the direction perpendicular to the longitudinal direction of the supply nozzle, in which the substrate holding portion seals a slit formed between the liquid-receiving base and the outer peripheral portion of the substrate so as not to leak out the process solution from the slit, and the process solution is supplied from the supply nozzle to the liquid-receiving base to mount the process solution on the liquid-receiving base, and the process solution is subsequently mounted over an entire surface of the substrate by spraying the process solution from the supply nozzle while moving the supply nozzle.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Keizo Kofu, JP 28 1040
Konishi, Nobuo Yamanashi-ken, JP 30 1167

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