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Abstract

A polystyrenic resin composition comprising (A) a styrenic polymer composition containing (a) 1 to 99% by weight of a polystyrenic resin having the syndiotactic configuration, (b) 1 to 99% by weight of a polyamide resin, (c) 0.1 to 10% by weight of a compatibilizer which is compatible with component (a) and has a polar group reactive with component (b), and (d) 0 to 50% by weight of a rubbery elastomer and/or a modified rubbery elastomer, (B) specific amounts of a copper compound and an iodine compound, and optionally, specific amounts of (C) a phenolic compound, (D) N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide), (E) an ester of thiodipropionic acid or a derivative thereof, (F) a copper inhibitor, and (G) inorganic filler; and a molded article prepared from the polystyrenic resin composition. The polystyrenic resin composition shows excellent resistance to heat aging so that little change in physical properties or color is caused even after exposure to a high temperature for a long time, has excellent toughness, rigidity, heat resistance, and water resistance, and can advantageously be used as a material for various types of industrial product.

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First Claim