Solder bonding printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2000
Grant Date -
N/A
app pub date -
Mar 12, 1998
filing date -
Mar 12, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully