Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board
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United States of America Patent
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Jan 11, 2000
Grant Date -
N/A
app pub date -
Aug 18, 1997
filing date -
Feb 10, 1997
priority date (Note) -
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Abstract
A semiconductor device including a semiconductor chip; a plurality of electrodes provided on a surface of the semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of the plurality of conductive patterns being protruded from a periphery of the insulative board so as to function as an outer terminal; a connecting element for electrically connecting the outer terminal to a corresponding one of the plurality of electrodes; and a conductive element which is in electrical contact with a corresponding one of the plurality of conductive patterns.
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