Direct solder bumping of hard to solder substrate
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United States of America Patent
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-
Jan 18, 2000
Issued Date -
N/A
app pub date -
Jan 27, 1997
filing date -
Dec 29, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method has been formed for direct solder 'bumping' of wafers, chips and interconnection pads or traces on hard to solder surfaces such as aluminum and indium tin oxide. It has been discovered that conventional solders modified by the addition of a light reactive metal can be jetted in the form of microdroplets onto a hard to solder substrate and that the modified droplets will wet and bond to the surface of the hard to solder substrate. This makes it possible for the first time to create solder bumps on bare uncoated hard to solder substrates such as aluminum and indium tin oxide without the need for first applying a different surface which conventional solder will wet.
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