Process chamber and method for depositing and/or removing material on a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 25, 2000
Grant Date -
N/A
app pub date -
Aug 22, 1997
filing date -
Aug 22, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.
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