Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 25, 2000
Grant Date -
N/A
app pub date -
Mar 28, 1996
filing date -
Mar 28, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A controlled dielectric loss, sintered aluminum nitride body having a density of greater than about 95% theoretical, a thermal conductivity of greater than about 100 W/m-K, and a dissipation factor measured at room temperature at about 1 KHz selected from: (a) less than or equal to about 0.001; and (b) greater than or equal to about 0.01. A process for producing a controlled dielectric loss, sintered aluminum nitride body, comprising heat treating an aluminum nitride body at sintering temperatures, including providing a heat treatment atmosphere which effects a selected nitrogen vacancy population in the aluminum nitride body at the sintering temperatures, and cooling the aluminum nitride body from sintering temperatures at a controlled rate and in a cooling atmosphere effective to control the selected nitrogen vacancy population.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully