Method for reinforcing structures

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United States of America Patent

PATENT NO 6017588
SERIAL NO

09030755

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method for reinforcing a structure comprising the steps of forming a primer layer on the surface of a structure to be reinforced; forming if necessary a putty layer on the primer layer; applying an impregnating resin on the formed primer layer provided that the putty layer in case where the putty layer is formed on the primer layer, before, after or before and after cladding with the fiber sheets, to allow the resin to penetrate into the spaces in the fiber sheets; and curing the resin, the said primer, putty and impregnating resin comprising a resin composition which can cure at a temperature not more than 5.degree. C.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008251 ?1008251
SHOWA HIGHPOLYMER CO LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katano, Hiroaki Yokohama, JP 5 24
Nemoto, Takeshi Isesaki, JP 7 34
Shibata, Joji Isesaki, JP 2 13
Tanaka, Tsuneo Yokohama, JP 27 552
Watanabe, Takeshi Yokohama, JP 641 6223
Yada, Mitsuhiro Isesaki, JP 7 47

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