Integrated vacuum and plating cluster system
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United States of America Patent
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Jan 25, 2000
Grant Date -
N/A
app pub date -
Jul 17, 1998
filing date -
Jul 17, 1998
priority date (Note) -
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Abstract
An apparatus and method for providing an integrated processing system allowing for the isolation of non-compatible processes used to deposit a material onto a semiconductor wafer and/or remove material from a wafer is described. The integrated processing system of the present invention is comprised of a first processing chamber for processing a substrate in a first environment coupled to a second processing chamber for processing a substrate in a second environment. A connecting interface coupled to the first and second processing chambers allows the first and second processing chambers to be isolated from each other as needed. Further, the connecting interface allows a wafer to be transferred from the first processing chamber to the second processing chamber within a controlled environment. The first and second processing chambers may be or may include cluster tools.
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