Semiconductor flip chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 25, 2000
Issued Date -
N/A
app pub date -
Feb 26, 1999
filing date -
Nov 8, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor flip chip package is provided having a semiconductor flip chip integrated circuit device and a laminated substrate. The laminated substrate has a conductive core and at least one lamina formed on the core layer. Each lamina has a dielectric layer and a conductive layer. The dielectric layer is formed at least in part from a fluoropolymer material having disposed therein an inorganic filler material. At least one via extends through the at least one lamina. The via has an entrance aperature of <75 microns and an aspect ratio of between 3:1 and 25;1. The laminated substrate includes a plurality of individual pads to which the individual solder ball connections of the semiconductor flip chip integrated circuit device are connected.
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