Multi-tip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 25, 2000
Issued Date -
N/A
app pub date -
Jun 25, 1998
filing date -
Jun 30, 1997
priority date (Note) -
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Abstract
An electrical pad for installation to a board, formed on the module substrate on which a plurality of tips is mounted, are divided into a plurality of divisional pads. Furthermore, each of the divisional pads are connected to each electrode terminals of those tips, and when installed, divisional pads of a pad are electrically connected to be united into a pad.
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