Thermal cycling module and process using radiant heat
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United States of America Patent
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Jan 25, 2000
Grant Date -
N/A
app pub date -
Feb 23, 1998
filing date -
Feb 23, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In general, the present invention provides a single thermal cycling module for baking and chilling a substrate, such as a wafer, that is in thermal contact with a foil heater, a heat exchanger, and a radiation heater. The radiation heater thermally heats a fluid contained by the heat exchanger, which in turn, thermally bakes the substrate at a desired temperature. When the radiation heater is deactivated, a fluid circulates through the heat exchanger to chill the substrate. The foil heater assists the baking and chilling phases by elevating the temperature of the substrate when necessary to prevent or regulate temperature fluctuations of the substrate temperature. Both the radiation heater and the foil heater can provide several zones for varying the heat applied across the substrate, and a single fluid temperature is provided to the heat exchanger for both baking and chilling cycles.
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