Method of manufacturing ball grid array semiconductor package
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United States of America Patent
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-
Feb 1, 2000
Grant Date -
N/A
app pub date -
Jan 26, 1998
filing date -
Jan 28, 1997
priority date (Note) -
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Abstract
Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.
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