Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer
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United States of America Patent
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Feb 8, 2000
Grant Date -
N/A
app pub date -
Jun 1, 1998
filing date -
Jun 1, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on a semiconductor wafer. The present invention is a adapter having at least one opening through which at least one electrode contacts the semiconductor wafer. The adapter may be designed to have multiple openings at specified locations on the adapter, thus allowing multiple electrode contacts with the semiconductor wafer at pre-specified locations. A conductive sheet may couple with the adapter to carry an electrical current from an electrical conductor to the electrode contacts placed within the openings of the adapter.
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