US Patent No: 6,022,483

Number of patents in Portfolio can not be more than 2000

System and method for controlling pressure

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Abstract

A system for controlling the pressure in a chamber with a computer controlled exhaust throttle valve. A characterization relationship describes the static properties of the valve geometry, valve actuation mechanism and gas flow properties. This characterization relationship can comprise a theoretical or empirical function which associates a sufficient number of valve positions with the corresponding pressure, and may be parameterized by other auxiliary variables such as inlet gas flow values, gas types and compositions. An inverse relationship between the current measurable variables of the process, such as pressure, inlet flows and other auxiliary parameters is defined. A linearization method uses the inverse relationship to modify the effect of the valve positioning on the corresponding value of pressure in such a way that the combined behavior of the process and the linearization method yields a linear relationship between a new control variable and the pressure. A linear feedback control method then controls the modified, linearized system.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WIND RIVER SYSTEMS, INC.ALAMEDA, CA85

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aral, Gurcan Cupertino, CA 16 201

Cited Art

Patent Info (Count) # Cites Year
 
LAM RESEARCH CORPORATION (1)
5,758,680 Method and apparatus for pressure control in vacuum processors 16 1996
 
THE CURATORS OF THE UNIVERSITY OF MISSOURI (1)
5,813,426 Vacuum regulator 3 1996
 
TOKYO ELECTRON LIMITED (1)
5,816,285 Pressure type flow rate control apparatus 38 1997

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (18)
7,335,396 Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers 10 2003
7,344,755 Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers 1 2003
7,235,138 Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces 0 2003
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DEKA PRODUCTS LIMITED PARTNERSHIP (7)
6,485,263 Systems for determining the volume of a volumetric chamber and pumping a fluid with a pump chamber 50 1999
8,158,102 System, device, and method for mixing a substance with a liquid 0 2003
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APPLIED MATERIALS, INC. (2)
6,655,408 Tunable ramp rate circuit for a mass flow controller 5 2001
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TOKYO ELECTRON LIMITED (2)
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HITACHI KOKUSAI ELECTRIC INC. (1)
7,883,581 Substrate processing apparatus and method of manufacturing semiconductor device 0 2009
 
HITACHI ZOSEN CORPORATION (1)
8,316,879 Method and device for controlling pressure of vacuum container 0 2008
 
LAM RESEARCH CORPORATION (1)
8,290,717 Methods and apparatus for wafer area pressure control in an adjustable gap plasma chamber 0 2009
 
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6,367,329 Acoustic time of flight and acoustic resonance methods for detecting endpoint in plasma processes 0 2000
 
NEC ELECTRONICS CORPORATION (1)
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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
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